Home
About Us
Company Profile
Corporate Culture
Quality System
Partner Brands
Product
5G Applications
Thermal Interface Materials
EMI Electromagnetic Shielding Materials
Wave-absorbing material
Heat dissipation component
Magnetic Components
Intelligent Manufacturing
Rugged Laptop
Plastic parts
Spot Model
Solution
5G Optical Communication
Communication Base Station
New Energy Vehicles
Security Electronics
Consumer Electronics
Power Supply
Medical Equipment
Blog
Company News
Industry News
FAQ
Technical Support
Product Manual
Production Process
Detection Equipment
Agency
Contact Us
Kingbolt
中文
English
Solutions
With the comprehensive rollout of 5G networks and the rapid development of technologies such as cloud computing and big data, global data traffic continues to grow steadily. The demand for stronger data processing capabilities and faster transmission speeds is driving optical modules towards higher rates such as 400G and 800G, with greater bandwidth and lower latency. Due to the significant increase in component integration and power consumption, the requirements for device heat dissipation and EMC are becoming increasingly stringent. Materials that can provide high-performance and low-cost thermal management and EMI...
With the comprehensive rollout of 5G networks and the rapid development of technologies such as cloud computing and big data, global data traffic continues to grow. The demand for stronger data processing capabilities and faster transmission speeds drives optical modules toward higher rates such as 400G and 800G, with greater bandwidth and lower latency. Due to the significant increase in component integration and power consumption, the requirements for device heat dissipation and EMC are becoming increasingly stringent. There is a need for thermal management materials and EMI materials that can provide high performance at low cost.